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Packaging Densification Through Thermoformed Shipping Media
In an effort to bring more value to its customers, and to reduce internal costs, Intel’s Logistics department place high focus on product packaging and transportation freight costs. It was at this time Intel’s Transportation Materials and Media Engineering (TMME) team worked on precision thermoforming technology as a potential replacement for the current Plastic Injected Molded Trays (PIMT). Through these efforts the TMME team has developed a precision thermoformed shipping tray that can be used completely across their supply chain including select internal manufacturing processes. The thermoformed tray is lighter in weight and substantially reduced customer returns for damage to the product associated with the shipping media; and provided several additional benefits such as cost savings and environmentally more friendly.
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